CAS No.  8001-54-5 or 63449-41-2, 139-07-1

Molecular weight:  340.0

Molecular Formula:  C21H38NCl           

Structural Formula:

CAS No.:26172-55-4, 2682-20-4

Molecular weight:115.16

tructural Formula:

Product Introduction  

This product is a single-component UV-curing adhesive. It features excellent flowability and high hardness, primarily mold-formed onto surfaces of silicone rubber, PC, and PET, and can also be directly dispensed/dot-printed onto substrates.

Product Introduction 

The product is a high performance sintered conductive adhesive, which is made of special powder, bonding material and organic carrier with excellent electrical conductivity.

Product Introduction   

KH-8090/8091/8093 conductive adhesive is a low temperature fast curing high conductivity adhesive designed for antenna and screen applications. It has good adhesion on ink layers, glass, aluminum alloy, ceramics, PET, PC, PI, LCP and other plastic substrates.

1.Formula: C7H10N2   Molecular weight:122   CAS:102-51-2 

2.This product is a light gray solid at room temperature, with amine taste, melting point:62.78°C, flash point:157.22°C,  spontaneous combustion temperature: 540°C. It is very unstable in the air, quickly discoloration, its hydrochloride is relatively stable, soluble in water, benzene, chloroform, ethylacetate, alcohol and other organic substances. This product is toxic, irritant to the skin.